(module DCT-MSOP-8_3x3mm_Pitch0.65mm (layer F.Cu) (tedit 58F8E4CF)
  (descr "8-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SSOP 0.65")
  (attr smd)
  (fp_text reference REF** (at 0 -2.6) (layer F.SilkS))
  (fp_text value DCT-MSOP-8_3x3mm_Pitch0.65mm (at 0 2.6) (layer F.Fab))
  (pad 1 smd rect (at -1.7 -0.975) (size 1.6 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.07))
  (pad 2 smd rect (at -1.7 -0.325) (size 1.6 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.07))
  (pad 3 smd rect (at -1.7 0.325) (size 1.6 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.07))
  (pad 4 smd rect (at -1.7 0.975) (size 1.6 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.07))
  (pad 5 smd rect (at 1.7 0.975) (size 1.6 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.07))
  (pad 6 smd rect (at 1.7 0.325) (size 1.6 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.07))
  (pad 7 smd rect (at 1.7 -0.325) (size 1.6 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.07))
  (pad 8 smd rect (at 1.7 -0.975) (size 1.6 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.07))
  (model Housings_SSOP.3dshapes/MSOP-8_3x3mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
