(module MSOP-10-1EP_3x3mm_Pitch0.5mm (layer F.Cu) (tedit 5591538D)
  (descr "MSE Package; 10-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081664_I_MSE.pdf)")
  (tags "SSOP 0.5")
  (attr smd)
  (fp_text reference U8 (at 0 -2.55) (layer F.SilkS))
  (fp_text value LM25011 (at 0 2.55) (layer F.Fab))
  (pad 1 smd rect (at -2.105 -1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.105 -0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.105 0) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.105 0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.105 1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.105 1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.105 0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2.105 0) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 2.105 -0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 2.105 -1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 11 thru_hole circle (at 0.42 0.47) (size 0.762 0.762) (drill 0.3556) (layers *.Cu *.Mask F.SilkS)
    (solder_paste_margin_ratio -0.2))
  (pad 11 thru_hole circle (at 0.42 -0.47) (size 0.762 0.762) (drill 0.3556) (layers *.Cu *.Mask F.SilkS)
    (solder_paste_margin_ratio -0.2))
  (pad 11 thru_hole circle (at -0.42 0.47) (size 0.762 0.762) (drill 0.3556) (layers *.Cu *.Mask F.SilkS)
    (solder_paste_margin_ratio -0.2))
  (pad 11 thru_hole circle (at -0.42 -0.47) (size 0.762 0.762) (drill 0.3556) (layers *.Cu *.Mask F.SilkS)
    (solder_paste_margin_ratio -0.2))
  (pad 11 smd rect (at 0 0) (size 1.7272 1.7272) (layers F.Cu F.Paste F.Mask))
  (model Housings_SSOP.3dshapes/MSOP-10-1EP_3x3mm_Pitch0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
